TMPU-1002
这是一种高纯度的二氧化钛（TiO2）材料，主要用于沉积薄膜，特别是在半导体制造、光学器件和磁性器件等领域有广泛应用。该产品具有高纯度、良好的均匀性和长使用寿命等特点。
磁控溅射靶材料在半导体制造中的应用主要包括以下几个方面：
晶圆制造：靶材在晶圆制造环节主要用于晶圆导电层、阻挡层以及金属栅极的制作。例如，铝靶和铜靶常用于制作导电层，而钛靶和钽靶则常用于制作阻挡层。这些靶材的纯度要求极高，通常在5N（99.999%）以上，以确保薄膜的质量和性能
芯片封装：在芯片封装环节，靶材用于生成凸点下金属层、布线层等金属材料。这些材料对于芯片的电性能和稳定性至关重要，因此对靶材的纯度和均匀性有严格的要求
导线工艺：在半导体芯片的制作中，靶材用于制作传递信息的金属导线。这些导线通过特殊的加工工艺，将沉积在芯片表面的金属薄膜刻蚀成纳米级别的金属线，连接芯片内部的微型晶体管，实现信号传递
高介电常数的介质金属栅极技术：钛材料作为高介电常数的介质金属栅极技术的主要材料，这是在芯片制造中用于提高性能和降低功耗的关键技术
晶圆接合焊盘工艺：铝材料在晶圆接合焊盘工艺中作为主要材料，这是在芯片封装过程中重要的一步，用于确保芯片与外部电路的连接
TMPU-1002
This is a high-purity titanium dioxide (TiO2) material, mainly used for deposition thin films, especially in semiconductor manufacturing, optical devices and magnetic devices have a wide range of applications. The product has the characteristics of high purity, good uniformity and long service life.
The application of magnetron sputtering target materials in semiconductor manufacturing mainly includes the following aspects:
Wafer manufacturing: The target material is mainly used in the wafer manufacturing process for the production of conductive layer, barrier layer and metal gate. For example, aluminum and copper targets are often used to make conductive layers, while titanium and tantalum targets are often used to make barrier layers. The purity of these targets is extremely high, usually above 5N (99.999%), to ensure the quality and performance of the film
Chip packaging: In the chip packaging link, the target is used to generate metal layers under the convex points, wiring layers and other metal materials. These materials are critical to the electrical properties and stability of the chip, so there are strict requirements for the purity and uniformity of the target
Wire process: In the manufacture of semiconductor chips, the target material is used to make metal wires that transmit information. These wires, through a special processing process, etch the metal film deposited on the surface of the chip into nanoscale metal wires, which connect the micro transistors inside the chip to achieve signal transmission
Dielectric metal gate technology with high dielectric constant: Titanium material is the main material of dielectric metal gate technology with high dielectric constant, which is the key technology used to improve performance and reduce power consumption in chip manufacturing
Wafer bonding pad process: Aluminum is used as the main material in the wafer bonding pad process, which is an important step in the chip packaging process to ensure that the chip is connected to the external circuit
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